Senior Advanced Packaging Engineer
hace 19 horas
Barcelona
ppWe are scientists, doctors, techies and humanity lovers, with the mission of building neuroelectronic interfaces to cure brain disorders. INBRAIN harnesses the extraordinary material properties of Graphene, the world’s thinnest and nobel-prize winning material, to build safe, uninvasive and highly efficient neural solutions. Our mission is to decode and modulate neural networks to improve people's lives. /p pAs a Senior Advanced Packaging Engineer, you will be the technical architect of metrology, electrical test and data analysis infrastructure. The primary goal is to invent, build and operate the automated test systems required to characterize complex vertical integration processes (advanced packaging, TGV, electromechanical reliability). /p pYou will be at the forefront of bringing advanced healthcare solutions to market, making a tangible difference in people´s lives worldwide. This position will be office-based in Bellaterra. /p h3Main responsibilities /h3 ul libTest Strategy Equipment Setup: /b Define and deploy the test infrastructure required to characterize 3D MEMS process steps thermal bonding, wafer‑level packaging, TGV, electrochemical or mechanical reliability testing. Specify, qualify and operate metrology, electrical test, and reliability equipment. /li libProcess Characterization DOEs: /b Design and execute structured experiments to characterize 3D MEMS unit processes and integrated flows. Generate the data needed to set process windows, control limits, and acceptance criteria across coupled process steps. /li libData Analysis Industrialization: /b Build Python‑based data pipelines to analyze high‑volume process and test data. Extract yield, Cpk, drift, and failure‑mode signatures. Translate findings directly into process and test recipe improvements. /li libHardware Electrical Characterization: /b Lead electrical and physical characterization across 3D MEMS structures. Use SMUs, DAQs, oscilloscopes, probe stations, and dedicated MEMS test rigs to measure critical parameters at the required precision. /li libMaterials Failure Analysis: /b Apply materials science fluency, thin films, interfaces, integration physics, to root‑cause analysis on failures across bonding, packaging, TGV interfaces and electromechanical reliability. Feed findings back to process and design teams to drive iterations. /li libCross‑Functional Coordination: /b Work directly with Process Integration, Packaging, Hardware, mechanical and Software teams to align test requirements, hardware specifications, and data infrastructure. Translate 3D MEMS physics into testable specifications across disciplines. /li libIndustrialization Scaling: /b Take prototype test setups out of RD and harden them for pilot and production. Author SOPs, qualify equipment (IQ / OQ / PQ), and integrate with MES where applicable. /li libContinuous Improvement: /b Identify opportunities to reduce variation, improve test throughput, and tighten the link between process control and electrical / yield outcomes across the 3D MEMS stack. /li /ul h3Mandatory Qualifications and Soft skills /h3 ul liBachelor’s or Master’s degree in Electrical Engineering, Applied Physics, Materials Science, Microelectronics, or a related field. /li lib5+ years in Test Development, Device Characterization, or Yield Engineering within a semiconductor, MEMS, or advanced packaging environment. /b /li libVertical Integration MEMS Expertise: /b Hands‑on experience with testing and characterizing advanced packaging architectures, including wafer‑level thermal bonding, Through‑Glass Vias (TGV) / TSV metallization, and electromechanical reliability. /li libData Science Scripting: /b High proficiency in Python (e.g., Pandas, NumPy, SciPy) for complex data analysis, instrument control (SCPI/VISA), and automating high‑volume, lot‑level data workflows. /li libTest Equipment Instrumentation: /b Hands‑on expertise building test setups with SMUs, DAQs, oscilloscopes, and automated metrology tools. Highly capable of debugging signal integrity for low‑noise/high‑impedance analog measurements. /li libPhysics of Failure: /b Deep understanding of semiconductor/MEMS device physics, thin films, and electromechanical integration. Must understand why an interface fails (e.g., CTE mismatch, delamination, voiding) to design accurate test traps. /li libIndustrialization Track Record: /b Proven ability to take prototype test platforms out of RD and industrialize them for pilot or production use, including authoring SOPs and executing equipment qualification (IQ/OQ/PQ). /li liSystematic, first‑principles approach to problem‑solving. /li liA strong instinct for identifying RD fragility. /li liStrong written and verbal communication. /li liTakes full ownership of test strategy, equipment readiness, and data quality. /li liThrives in fast‑moving, unstructured deep‑tech environments. /li /ul h3Nice to have (optional) /h3 ul libDatabase Architecture: /b Experience interfacing automated test hardware with Manufacturing Execution Systems (MES) or SQL databases, and building visual dashboards (e.g., Grafana, PowerBI) for tracking yield and Cpk. /li libReliability Environmental Testing: /b Practical knowledge of accelerated aging models, hermeticity testing (leak rate analysis), and Electrochemical Impedance Spectroscopy (EIS). /li libNeurotechnology Mixed‑Signal Electronics: /b Familiarity with high‑channel‑count analog front‑ends (AFEs), custom ASICs, or complex neural electrophysiology signal chains. /li libStatistical Process Control: /b Working knowledge of PFMEA, DOE methodology, SPC, and Cpk‑driven process control in regulated manufacturing environments. /li libPilot‑to‑Production Scaling: /b Prior experience supporting a deep‑tech hardware company through a pilot‑to‑production transition, including capital tooling and scale‑up decisions. /li /ul pWe are looking for someone who is ready to proactively bring new ideas to the team, push boundaries, and constantly look for innovation. At INBRAIN we believe in shared success and diverse ways of thinking, here you'll learn, grow, and advance in an innovative culture. /p h3WHAT CAN WE OFFER TO YOU? /h3 ul liA collaborative environment where innovative ideas flourish and teamwork drives us forward. At INBRAIN, we believe the power of collective intelligence is unique. You will be part of a team that thrives on open communication, knowledge sharing and mutual respect. /li liMeaningful Work Impact: Our projects are not only exciting and challenging but also have a positive impact on the industry and society as a whole. You'll be part of a team that strives to create meaningful change. /li liCutting‑Edge Technology Exposure: Joining us means immersing yourself in the latest technologies and innovative solutions. You'll have access to state‑of‑the‑art tools and resources, fostering continuous learning and keeping your skills relevant in a rapidly evolving industry. /li liCompetitive salary (according to your experience/skills) /li liInternal flexible compensation scheme /li liPrivate Health Insurance /li liTraining bonus for professional development and access to Udemy platform /li li23 vacation days per year /li liChristmas week off /li liWhile we offer flexible working modality, because of the nature of this position, this will be an office‑based position in Bellaterra. /li /ul pApplications must be submitted in English. /p pAt INBRAIN, we're not just offering a job – we're inviting you to be part of a transformative journey, Are you ready to transform lives? Join us! /p p#diverseandinclusive /p pWe believe that a diverse and well‑balanced workforce drives innovation, and at INBRAIN we foster the inclusion of all people regardless of culture, age, gender, sexual orientation and identity, or any other status. /p /p #J-18808-Ljbffr